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CAE analysis service

Our CAE service helps you develop products more efficiently.

Advantages of CAE (Computer-Assisted Engineering)

  • Shortened product cycle
  • Lighter, thinner, shorter and smaller
  • Maximizing cost reduction

We will analyze CAD data you provide for the molded product and report the results.
If you wish to perform the analysis at your company, we will submit our resin physical property data in conventional CAE software format.

Software configuration

Software configuration

Various output result examples

Flow analysis

Injection molding analysis example: Resin filling behavior in the mold

Injection molding analysis example: Resin filling behavior in the mold

Filling analysis

Performing filling analysis allows , the following predictions :

      • Resin flow pattern in cavity, weld position
      • Mold clamping force, filling pressure and availability of filling during molding
      • Prediction of pressure distribution and temperature distribution

Prediction example of pressure distribution and temperature distribution

Prediction example of pressure distribution and temperature distribution

Mold cooling and warpage analysis

Mold cooling analysis

Our cooling analysis takes the mold cooling piping and cooling conditions into consideration. It supports shortened molding cycles and reduces warpage and sink marks.

Box-shaped mold surface temperature distribution (50 seconds after injection)

Molded product surface temperature at ejection

Molded product surface temperature at ejection

Mold surface temperature at ejection

Mold surface temperature at ejection

Warpage analysis using mold temperature distribution

There is scope to analyze warpage using mold temperature distribution data obtained from mold cooling analysis.
This works well when warpage dominates due to mold factors.

Verification of the inwardly warping box shape (using the above mold cooling analysis results)

Warpage displacement distribution map (using the mold cooling analysis results above)

Stress analysis

  • Stress deformation analysis
    Predicts the stress distribution and displacement distribution when a load or forced displacement is applied to a molded product in a predetermined position.
  • Thermal stress analysis predicts the thermal stress between different material interfaces due to changes in temperature.
  • reep deformation analysis
    Predicts permanent (creep) deformation when a load is applied over a an extended period.

Stress deformation analysis example: Analysis simulating a fatigue test

stress distribution map

stress distribution map

Displacement distribution map